Find great deals for 1x Intel AFIBM BGA Chipset With Lead Solder Balls. Shop with confidence on eBay!. Model Number: AFIBM SLB8Q. Date Code: 1 PCS intel AFIBM SLB8Q BGA Chipset with solder balls. 1 PCS intel . AFIBM. BGA: CHIP. AFIBM S LB8Q Specifications: Manufacturer: Intel ; Product: Mobile Chipsets ; Operating Supply Voltage: V, V, V, 5 V ; Maximum Operating.
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Intel AFIBM SL8BQ IBM BGA IC Chip with Solder Balls
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Learn more – opens in new window or tab. Whether using one or inteel hard drives, users can take advantage of enhanced performance and lower power consumption. Intel refers to these processors as tray or OEM processors. Please enter 5 or af82801iibm numbers for the ZIP Code. Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload.
Dear Buyers, Please pay attention to the following instruction upon receipt our chips. Seller information see-ic Support Home Product Specifications Chipsets. Delivery times may vary, especially during peak periods.
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Intel AF82801IBM SL8BQ 82801IBM BGA IC Chip with Solder Balls
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Intel® 82801IBM I/O Controller
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